Voltage Islet management for optimizing SoC Power Consumption
IP SOC Japan 2007M.Depeyrot, J.F.Pollet
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DOLPHIN Integration Supports Lynguent for Excellence in AMS Modeling
Design, Automation and Test in Europe (DATE) ynguent® Inc. and DOLPHIN Integration SA announced their agreement to provide best-of-class solutions for analog and mixed-signal (AMS) circuit designers. Lynguent’s innovative offering, ModLyng™ Integrated Modeling Environment, is a unique graphical tool for developing AMS behavioral models. ModLyng will create models tuned for DOLPHIN Integration’s single kernel SMASH™
DOLPHIN Integration Supports Lynguent for Excellence in AMS Modeling Read More »
Simulating Microsystems in the Context of an Automotive Drive ApplicationAMAA’06G.Pelz, C.Decker, D.Metzner, D.Dammers, L.M.Voßkämper
Abstract The opportunities to integrate more and more functionality into a (micro)system-in-a-package (SiP) heavily call for advanced methodologies in modeling and simulation for complete systems. For a microelectronics company like Infineon Technologies, the top-level simulation of our products, i.e. the above microsystems, is not a nice-to-have feature – it is a must! Iterating on the
Programmable Architectures of Mixed Signal Systems-on-Chip for Portable Consumer devicesEmbedded systems conference Tel-Aviv
A new paradigm is evolving because a SoC is not a mere Microcontroller IC just fashionably renamed, but a Programmable Architecture with hierarchical design-in of Virtual Components of Silicon IP. All portable consumer SoC’s tend to become mixed signal for cost-effectively embedding Power Management Units or DC-DC converters as well as A/D and D/A converters.
IDRT-aware SoC Integration FlowIP/SOC 2005A.Bonzo, L.Engels, F.Poullet
Abstract Systems-on-Chip integrators are facing the need to integrate the mixed signal virtual components, which best perform sensitive I/O functions. They must address hierarchically the interactions, instead of the traditional approach operating flatly on the lowest level, as this suffers from a double- whammy, as follows. A new integration process must make room for the
IDRT-aware SoC Integration FlowIP/SOC 2005A.Bonzo, L.Engels, F.Poullet Read More »
IP packaging based on XML signaturesIP/SOC 2005G.Saucier, L.Ghanmi, M.Hamdoun, D.Maurer
Abstract This paper presents “best practice” up to a “standard” for packaging and delivering IP versions/configurations based on “XML signatures”; A XML layer is created on top of the files defining virtual IP version/configurations When delivering an IP to a consumer he gets in addition to the files its “XML signature” providing him a comprehensive
IP packaging based on XML signaturesIP/SOC 2005G.Saucier, L.Ghanmi, M.Hamdoun, D.Maurer Read More »
From chip to system design using a co-verification environmentEmbedded Control Europe MagazineD.Maure, L.M.Voßkämper
The field of mechatronics encompasses all applications where electrical, electro-mechanical and pure mechanical elements are applied to build up a system with a required functionality. For rapid and reasonably priced development, it is an absolute necessity, along with the construction of prototypes, to simulate all involved components commonly in an efficient way. This is a
