Mixed signal simulation with SMASHDesign Wave Magazine -japanese
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SUCCESS for embedded soft and hard coverification of SoCEmbedded Systems, Israël, Tel AvivA.Magiorani, P.Sauge
Abstract Covalidating hardware and software remains a complex task for SoC designers. Isolated Instruction Set Simulators (ISS) and hardware simulators are readily available from diverse suppliers, but none can offer a complete solution for simulating a whole SoC with its software application: i.e. simulation of the microprocessor together with interconnected peripherals: logic, analog, memories… which
PRINCETON Technology of Taiwan confirms the consistency of DOLPHIN Integration’s contribution to competitiveness of outstanding fabless IC supplier
On the threshold of the tenth cycle of the semiconductor industry, SoC Integration is driven to lower power-consumption and higher design-yield, toward which PTC is striving with state-of-the-Art Virtual Components and EDA solutions from DOLPHIN Princeton Technology Corporation of Taipei, Taiwan and DOLPHIN Integration SA of Meylan, France are disclosing their series of licensing agreements,
MEMSCAP and DOLPHIN partner to bring high level language solutions for MEMS simulation to market
MEMSMaster deploys MEMSCAP modeling expertise and powerful design environment enabled by Dolphin’s SMASH single engine, mixed-signal, multi-level and multi-language simulator. MEMSCAP (Euronext : MEMS), the leading provider and manufacturer of innovative solutions and products based on micro-electro mechanical systems (MEMS) and DOLPHIN Integration, today announce the launching of MEMSMaster powered by SMASH, a new dedicated
Motor Modeling Based on Physical Effect ModelsIEEE International Workshop on Behavioral Modeling and Simulation (BMAS) Santa Rosa, California, USAD.Dammers, P.Binet, G.Pelz, L.M.Voßkämper
Abstract Modeling of complex electromechanical systems can be simplified by dividing the mechanical part of the system into basic physical effects. These basic physical effects have been used for microsystem modeling and – as shown in this paper – can also be used in modeling electro-mechanics of macro scale. The reuse of these models from
A GSM receiver base band in 0.25m, 1.8V fully depleted SOI including a 4th order serial DS A/D converterESSCIRC (2001)E.Compagne, J.Sevenhans, C.Raynaud
Abstract SOI technology is very promising for digital low voltage low power devices, but radio integration requires also the base band analog and the RF circuits to be realised in the same technology for a single chip radio. In the analog circuits we learn to live with the kink effect and in the RF we
Universelle Modellierung mikromechanischer Strukturen für den Einsatz in SystemsimulationenVortrag ASIM Workshop Modellierung und Simulation technischer Systeme, Dresden, GermanyL.M.Voßkämper, R.Schmid, G.Pelz
Abstract Im Gegensatz zu klassischen objekt-orientierten Modellierung mikromechanischer Strukturen, wie zum Beispiel bei der Beschreibung von Platten, Aufhängun- gen, Antrieben, etc. [4], stellt diese Arbeit die Kombination von Modellen physikalischer Basiseffekte zu Objektmodellen vor, welche für eine Systemmodellierung geeignet ist. Dies erlaubt eine freie Wahl der Effekte, die bei der Simulation berücksichtigt werden sollen. Darüber
