News Archive - Page 50 of 50 - Accelerate Energy Efficient SoC designs

Modeling Micro-Mechanical Structures for System Simulations
Forth International Forum on Design Languages (FDL) (2001), Lyon, France
L.M.Voßkämper, R.Schmid, G.Pelz

Abstract In contrast to classical object-oriented electromechanical modeling, i.e. describing plates, suspensions, drives etc., this paper proposes to combine models of basic physical effects to object models which in turn can be used for system modeling. This allows to freely choose which effects are to be considered for some simulation. Moreover, the development of new […]

Modeling Micro-Mechanical Structures for System Simulations
Forth International Forum on Design Languages (FDL) (2001), Lyon, France
L.M.Voßkämper, R.Schmid, G.Pelz Read More »

Challenges in mixed-signal design for the SoC area
Date Conference, München, Germany (2001)
J.F.Pollet

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Challenges in mixed-signal design for the SoC area
Date Conference, München, Germany (2001)
J.F.Pollet Read More »

Combining Models of Physical Effects for Describing Complex Electromechanical Devices
EEE/ACM International Workshop on Behavioral Modeling and Simulation (BMAS), Orlando, Florida, USA
L.M.Voßkämper, R.Schmid, G.Pelz

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Combining Models of Physical Effects for Describing Complex Electromechanical Devices
EEE/ACM International Workshop on Behavioral Modeling and Simulation (BMAS), Orlando, Florida, USA
L.M.Voßkämper, R.Schmid, G.Pelz Read More »

IP für MEMS
Lecture for the GI/GMM/ITG trade conference in Boeblingen
L.M.Voßkämper, G.Pelz

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IP für MEMS
Lecture for the GI/GMM/ITG trade conference in Boeblingen
L.M.Voßkämper, G.Pelz Read More »

A real “softness” of mixed signal “hard” virtual components
DesignCon Conference, Santa Clara, USA
J.F.Pollet

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A real “softness” of mixed signal “hard” virtual components
DesignCon Conference, Santa Clara, USA
J.F.Pollet Read More »

Virtual test with VHDL-AMS for a Generator of Analog and Mixed Signal Virtual component
Viuf (1999)
B.Babba, G.Barret, F.Poullet

Abstract With the increase in the complexity of systems with mixed-signal components, many systems designers recognize advantages and necessity of the mixed-signal simulation of these systems as a whole. Unfortunately, modeling and simulating such complex systems takes an enormous amount of time. The first problem identified is the speed of analog simulation. The second problem

Virtual test with VHDL-AMS for a Generator of Analog and Mixed Signal Virtual component
Viuf (1999)
B.Babba, G.Barret, F.Poullet Read More »

Electromechanical Modeling beyond VHDL-AMS
IEEE/ACM International Workshop on Behavioral Modeling and Simulation (BMAS), Orlando, Florida, USA
L.M.Voßkämper, A.Lüdecke, M.Leineweber, G.Pelz

Abstract Analytical modeling for electromechanics sometimes requires features like the representation of bended struc- tures, the inclusion of (moving) boundary conditions or spatial integrations and differentiations. All these points are currently not directly addressed in VHDL-AMS and other analog hardware description languages. This paper illustrates this, using the example of a capacitive pressure sensor. The

Electromechanical Modeling beyond VHDL-AMS
IEEE/ACM International Workshop on Behavioral Modeling and Simulation (BMAS), Orlando, Florida, USA
L.M.Voßkämper, A.Lüdecke, M.Leineweber, G.Pelz Read More »

Cooperative Design-in Process from SIP to SoC
IP99, Santa Clara, USA
J.F.Pollet

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Cooperative Design-in Process from SIP to SoC
IP99, Santa Clara, USA
J.F.Pollet Read More »

Mixed Signal Virtual Components Meeting the challenge of Design Reuse and Time-To-Market to a flexible high resolution ADC generator
IP98, Frankfurt, Germany
J.F.Pollet

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Mixed Signal Virtual Components Meeting the challenge of Design Reuse and Time-To-Market to a flexible high resolution ADC generator
IP98, Frankfurt, Germany
J.F.Pollet Read More »

Technology Trends: Design automation – More work needed on mixed-signal VC front
Electronic Engineering Times
J.F.Pollet

System-on-a-chip (SOC) designs involving mixed-signal virtual components (VCs) require integration with thousands of logic gates without noise interference. Meeting the challenges of this type of design, Dolphin Integration and NEC Electronics (Europe) recently created a Codec VC for audio and telecommunications applications. The design successfully integrated A/D and D/A converters, programmable- gain functions and digital

Technology Trends: Design automation – More work needed on mixed-signal VC front
Electronic Engineering Times
J.F.Pollet Read More »

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News

Modeling Micro-Mechanical Structures for System Simulations
Forth International Forum on Design Languages (FDL) (2001), Lyon, France
L.M.Voßkämper, R.Schmid, G.Pelz

Challenges in mixed-signal design for the SoC area
Date Conference, München, Germany (2001)
J.F.Pollet

Combining Models of Physical Effects for Describing Complex Electromechanical Devices
EEE/ACM International Workshop on Behavioral Modeling and Simulation (BMAS), Orlando, Florida, USA
L.M.Voßkämper, R.Schmid, G.Pelz

IP für MEMS
Lecture for the GI/GMM/ITG trade conference in Boeblingen
L.M.Voßkämper, G.Pelz

A real “softness” of mixed signal “hard” virtual components
DesignCon Conference, Santa Clara, USA
J.F.Pollet

Virtual test with VHDL-AMS for a Generator of Analog and Mixed Signal Virtual component
Viuf (1999)
B.Babba, G.Barret, F.Poullet

Electromechanical Modeling beyond VHDL-AMS
IEEE/ACM International Workshop on Behavioral Modeling and Simulation (BMAS), Orlando, Florida, USA
L.M.Voßkämper, A.Lüdecke, M.Leineweber, G.Pelz

Cooperative Design-in Process from SIP to SoC
IP99, Santa Clara, USA
J.F.Pollet

Mixed Signal Virtual Components Meeting the challenge of Design Reuse and Time-To-Market to a flexible high resolution ADC generator
IP98, Frankfurt, Germany
J.F.Pollet

Technology Trends: Design automation – More work needed on mixed-signal VC front
Electronic Engineering Times
J.F.Pollet

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